國際商務(wù)函電

出版時(shí)間:2007-8  出版社:北京理工大學(xué)出版社  作者:郭莉  頁數(shù):132  字?jǐn)?shù):205000  

內(nèi)容概要

國際商務(wù)函電是高職高專院校國際貿(mào)易專業(yè)主干課程,也是一門重要的語言技能課。體現(xiàn)基礎(chǔ)英語、專業(yè)英語和專業(yè)知識的三結(jié)合,使之成為一門系統(tǒng)性、指導(dǎo)性和可持續(xù)性較強(qiáng)的課程。本書內(nèi)容涵蓋了書信結(jié)構(gòu),建立業(yè)務(wù)關(guān)系,詢盤、報(bào)盤和還盤,成交,支付方式,包裝,裝運(yùn),保險(xiǎn),索賠和理賠以及代理,投資,加工裝配貿(mào)易和補(bǔ)償貿(mào)易等其它貿(mào)易方式。        本書可作為經(jīng)濟(jì)貿(mào)易類學(xué)科的專業(yè)教材或輔助教材,也可作為其他層次、其他形式的外貿(mào)函電知識教育和培訓(xùn)的參考用書。

書籍目錄

Chapter 1  I ntroduct i on 1.1  IIltroduction 1.2 Seven Principal Parts and Seven Optional Parts 1.3 Two Styles of Layout 1.4 EnvelopeChapter 2 EstabI i shment of Business Relations 2.1  Introduction 2.2 Teaching ContenmChapter 3  Cred i t Status 3.1  Introduction 3.2 Teaching ConmntsChapter 4  Enqu i r i es/0ffers/Counter—offer/Acceptance 4.1  Introduction 4.2 Enquiry Letters 4.3  0ffer Letters 4.4 Counter-offer and Acceptance LettersChapter 5 0rder 5.1  Introduction 5.2 AnOrder 5.3 Acknowledgement of an Initial Order 5.4 Rejecting Ordered Price 5.5 Placing a Duplicate Order 5.6 Declining an OrderChapter 6  Contract 6.1  Introduction 6.2 Confh'ming a Purchase 6.3 Confirming an Order 6.4 Conclusion of Business 6.5 Sending a Sales ContractChapter 7 Shipment 7.1  Introductlon 7.2 Packing Requirements 7.3 S1lipping Marks 7.4 TranssMpment and Partial Sllipmem 7.5 Urging Sllipmem 7.6 Requesting Postponement of Shipment 7.7 Stlipping Instruction 7.8 Sllipping Advice 7.9 Specimen’Letter for Optional studyChapter 8 Payment 8.1  Introduction 8.2 Asking for Payment by TIT 8.3 Accepting D/P PaymentChapter 9  I nsurance 9.1 Introduction 9.2 Asking for Excessive Insurance 9.3 0pen Policy 9.4 Informing the Customer of the Insurance Rate 9.5  Franchise 9.6 Sending Insurance Policy 9.7 Specimen Letter for Optional Study 9.8 Material for Optional StudyChapter 10 CompIaint and CIaim 10.1  Introduction 10.2  Claim LettersChapter 11 FIexibIe Trade 11.1  Introduction 11.1 Agency 11.3 Processing and Assembly Trade 11.4 Compensation Trade 11.5 Joint Venture 11.6 Techhology Transfer. 11.7 Invitation for Bid and Bid

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