材料科學(xué)與工程基礎(chǔ)

前言

　　隨著我國(guó)國(guó)際交流與合作不斷深入，雙語(yǔ)教學(xué)也逐漸受到各大學(xué)的重視并率先在部分基礎(chǔ)課和專業(yè)基礎(chǔ)課中進(jìn)行了嘗試，取得了良好的效果。雙語(yǔ)教學(xué)與外語(yǔ)教學(xué)不同，它是通過(guò)外文載體傳授學(xué)科知識(shí)，使學(xué)生通過(guò)外文而不是中文去理解和掌握專業(yè)知識(shí)和理論，為學(xué)生奠定一個(gè)良好的外語(yǔ)環(huán)境。工程材料是我校最早被選定作為雙語(yǔ)教學(xué)的課程之一，在教學(xué)內(nèi)容選擇、教學(xué)方法研討、教學(xué)理念更新上進(jìn)行了有益的探索。但是，教材問(wèn)題長(zhǎng)期困擾課程建設(shè)，影響該課程教學(xué)效果的進(jìn)一步提高。國(guó)外原版教材雖然具有內(nèi)容先進(jìn)、信息量大、數(shù)據(jù)翔實(shí)、圖表案例豐富、語(yǔ)言純正、印刷美觀等特點(diǎn)，但它存在著教材結(jié)構(gòu)、體系、標(biāo)準(zhǔn)與國(guó)內(nèi)不同的問(wèn)題，而且有些原版教材篇幅過(guò)大，內(nèi)容與我國(guó)現(xiàn)行教學(xué)基本要求不太一致。為此，解決工程材料課程的教材問(wèn)題成為雙語(yǔ)教學(xué)課程建設(shè)的瓶頸?！　”緯窃趨⒖紘?guó)外權(quán)威教材的基礎(chǔ)上，編寫的涉及材料科學(xué)與工程的發(fā)展前沿、內(nèi)容難易程度適中、概念闡述與具體實(shí)例緊密結(jié)合、便于學(xué)生學(xué)習(xí)與理解學(xué)科知識(shí)的工程材料英文教材。全書共分7章，分別闡述了晶體結(jié)構(gòu)與晶體缺陷、金屬機(jī)械性能、二元合金相圖、鐵碳合金相圖、鋼的熱處理、碳鋼及合金鋼、有色金屬及合金等機(jī)械類專業(yè)基礎(chǔ)內(nèi)容。系統(tǒng)地介紹了金屬的化學(xué)成分、組織結(jié)構(gòu)、機(jī)械性能和應(yīng)用特點(diǎn)方面的基本概念及基礎(chǔ)知識(shí)?！　”緯哂腥缦绿攸c(diǎn)：（1）為了使學(xué)生能夠順暢地與外國(guó)專家進(jìn)行學(xué)術(shù)交流，同時(shí)還能熟練地與國(guó)內(nèi)的工程技術(shù)人員進(jìn)行技術(shù)探討，我們?cè)诰帉戜摰臒崽幚?、碳鋼及合金鋼、有色金屬及合金等章?jié)時(shí)，詳細(xì)地?cái)⑹隽藝?guó)內(nèi)外金屬材料分類標(biāo)準(zhǔn)、牌號(hào)的使用等?！　。?）專業(yè)學(xué)科知識(shí)里出現(xiàn)的英文詞匯往往具有音節(jié)多、出現(xiàn)頻度少、常附有前后綴等特點(diǎn)，為便于學(xué)生閱讀連貫，對(duì)關(guān)鍵詞、基本概念、基本定義加上漢語(yǔ)注釋。

內(nèi)容概要

　　本書共分7章，分別闡述了晶體結(jié)構(gòu)與晶體缺陷、金屬機(jī)械性能、二元合金相圖、鐵碳合金相圖、鋼的熱處理、碳鋼及合金鋼、有色金屬及合金等機(jī)械類專業(yè)基礎(chǔ)內(nèi)容。系統(tǒng)地介紹了金屬的化學(xué)成分、組織結(jié)構(gòu)、機(jī)械性能和應(yīng)用特點(diǎn)方茴的基本概念及基礎(chǔ)知識(shí)。　　本書可作為高等工科院校機(jī)械類及近機(jī)類專業(yè)的重要技術(shù)基礎(chǔ)課程用書，同時(shí)可供從事材料研究與應(yīng)用的工程技術(shù)人員作為了解專業(yè)知識(shí)，提高專業(yè)英語(yǔ)水平的閱讀材料。

書籍目錄

Chapter 1 Crystalline Structures and Imperfections  1.1 Introduction  1.2 Classification of Materials  1.3 Structure of Atoms　1.4 Ideal Crystal, Space Lattice and Unit Cells　1.5 CrYstal Structures and Bravais Lattices　1.6 Cubic Unit Cells　1.7 Basic Crystalline Structures in Metals　1.8 Packing Factor　1.9 Directions and Planes in Crystalline Structures　　1.9.1 Directions in Cubic Unit Cell　　1.9.2 Miller Indices for Crystallographic Planes in Cubic Unit Cell　　1.9.3 Linear Density and Planar Density in Crystalline Structures　1.10 Crystalline Imperfections　　1.10.1 Point Defects　　1.10.2 Linear Defects (Dislocations)　　1.10.3 Planar Defects(Grain Boundaries)　　1.10.4 Metallographic Examination　ProblemsChapter 2 Mechanical Properties of Metals　2.1 Introduction　2.2 Materials Relationship　2.3 Tensile Properties　　2.3.1 Linear-Elastic Region and Elastic Constants　　2.3.2 Yield Point　　2.3.3 Ultimate Tensile Strength　　2.3.4 Measures of Ductility (Elongation and Reductionof Area)　2.4 Mechanism of Elastic and Plastic Deformation　　2.4.1 Metallic Bond　　2.4.2 Mechanism of Elastic Deformation　　2.4.3 Mechanism of Plastic Deformation　2.5 Other Mechanical Properties　　2.5.1 Compressiye Properties 　　2.5.2 Shear Properties　　2.5.3 Impact Toughness　2.6 Work Hardening　　2.6.1 Annealing of Work-hardened Materials　　2.6.2 Hot Working and Cold Working　2.7 Hardness Test　　2.7.1 Introduction　　2.7.2 Brinell Hardness Test　　2.7.3 Rockwell Hardness Test　　2.7.4 Vickers Hardness Test　　2.7.5 Scleroscope Hardness Tests　Problems Chapter 3 Binary Phase Diagram　3.1 Introduction　3.2 Metallic Solid Solutions　　3.2.1 Substitutional Solid Solutions　　3.2.2 Interstitial Solid Solutions　3.3 Binary Isomorphous Alloy Systems　3.4 Construction of Phase Diagrams 　　3.4.1 Cooling Curve　　3.4.2 Experimental Methods to Determine Phase Change Points　3.5 Solidification of Solid Solution Alloy　3.6 Binary Eutectic Alloy Systems　　3.6.1 Slow Cooling of a Pb-Sn Alloy of Eutectic Composition　　3.6.2 Slow Cooling of a 65% Pb-35% Sn Alloy　　3.6.3 Slow Cooling of a 16% Pb-84% Sn Alloy　3.7 Binary Eutectoid Reactions　3.8 Binary Peritectic Alloy Systems　3.9 Phase Diagram with Intermediate Phases and Compounds　ProblemsChapter 4 Iron-Carbon Equilibrium DiagramChapter 5 Heat Treatment of SteelsChapter 6 Carbon and Alloy SteelsChapter 7 Nonferrous Metals and Its AlloysReferencesAPPENDIX Ⅰ DefinitionsAPPENDIX Ⅱ Conversion Factors to SI Units

章節(jié)摘錄

　　Electronic Materials　　Electronic materials are not a major type of material by volume but arean extremely important type of material for advanced engineering technology. The mostimportant electronic material is pure silicon that is modified in various ways to change itselectrical characteristics. A multitude of complex electronic circuits can be miniaturizedon a silicon chip that is about 3/4 in. square （1.90 cm square）. Microelectronic deviceshave made pssible such new products as communication satellites， advanced comput-ers， handheld calculators， digital watches， and welding robots.　　The properties of these various classes of materials are usually rather distinct. Forinstance， metals are opaque to light， and reflective. They are usually ductile， meaningthat they can be bent before they break. They are electrically and thermally conducting.On the other hand ceramics and glasses are usually brittle， can be transparent to light，and are good insulators. They are particularly useful at high temperatures or in corro-sive environments， since they retain their properties. Most polymers， on the otherhand， cannot withstand high temperatures. Most of them are insulators， and many arehighly deformable which is the real meaning of the word ”plastic"， and some haveunique elastic properties （rubber bands）. Semiconductors， of course， are distinguishedby their electrical behavior. All of these property characteristics， and the reasons theyexist， are discussed in some detail in the chapters that follow.

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