射頻電路和射頻集成電路設(shè)計(jì)中的關(guān)鍵課題

出版時(shí)間:2005-2  出版社:高等教育出版社  作者:Richard Chi-Hsi Li  頁數(shù):395  字?jǐn)?shù):490000  
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內(nèi)容概要

本書著重論述和強(qiáng)調(diào)在射頻電路和射頻集成電路設(shè)計(jì)中的共同的關(guān)鍵性課題。內(nèi)容包括:射頻和射頻集成電路設(shè)計(jì)的核心部份: 阻抗匹配;基本射頻參數(shù)和方程式;射頻接地;從單端線路到差分線路;容許誤差分析;射頻集成電路設(shè)計(jì)中的難題;低噪聲放大器設(shè)計(jì)的討論。    本書的讀者對(duì)象是大學(xué)的高年級(jí)學(xué)生、研究生和工程技術(shù)人員。My motivation to write this book    Today, many books about RF (Radio Frequency) circuit design are available for students, researchers, and designers.  In these books, the operating principles and circuit topologies are well explained and presented.  In addition to offer training of the use of simulation tools, they enable a student who has just graduated from university to start RF circuit designing in his/her new job.

作者簡(jiǎn)介

Richard Chi-Hsi Li,male, was born in NanAn,QuanZhou ,Fujian,China .He graduated in the Physics Department of FuDan Unversity,Shanghai,China in 1985.From 1958 to 1973 .he and been working for the Institute of Geophysics ,Chineseacademy and the University o

書籍目錄

Chapter 1 Importance of Impedance Matching 1.1 Difference between RF and Digital Circuit Design  1.1.1 Case 1: Digital Circuits at Low Data Rate  1.1.2 Case 2: Digital Circuits at High Data Rate 1.2 Significance of Impedance Matching  1.2.1 Power Transportation from a Source to a Load  1.2.2 Maximizing of Power Transportation without Phase Shift  1.2.3 Conjugate Impedance Matching and Voltage Reflection Coefficient  1.2.4 Impedance Matching Networ 1.3 Problems due to Unmatched Status of Impedance  1.3.1 General Expression of Power Transportation  1.3.2 Power Instability and Additional Power Los  1.3.3 Additional Distortion and Quasi-Noise  1.3.4 Power Measurement  1.3.5 Power Transportation and Voltage Transportatio  1.3.6 Burning of a Transistor ReferencesChapter 2 Impedance Matching 2.1 Impedance Measured by Small Signal  2.1.1 Impedance Measured by S Parameter Measurement  2.1.2 The Smith Chart: Impedance and Admittance Coordinatio  2.1.3 Accuracy of Smith Chartl  2.1.4 Relationship between the Impedance in Series and in Parallel 2.2 Impedance Measured by Large Signal  2.3 Impedance Matching  2.3.1 One Part Matching Network  2.3.2 Recognition of Regions in a Smith Chart  2.3.3 Two Parts Matching Network  2.3.4 Two Parts Upward and Downward Impedance Transformer  2.3.5 Three Parts Matching Network and Impedance Transformer   2.3.5.1 Topology Limitation of Two Parts Matching Network   2.3.5.2 Π Type Matching Network    2.3.5.3 T Type Matching Network 2.4 Some Useful Schemes for Impedance Matching   2.4.1 Designs and Tests when ZL is not 50 Ω  2.4.2 Conversion between“T” and “Π” Type Matching Network  2.4.3 Parts in a Matching Network  2.4.4 Impedance Matching between Power Transportation Units  2.4.5 Impedance Matching for a Mixer ReferencesChapter 3RF Grounding 3.1 A True Story 3.2 Three Components for RF Grounding  3.2.1 “Zero” Capacitors   3.2.2 Micro Strip Line  3.2.3 RF Cable 3.3 Examples of RF grounding  3.3.1 Test PCB   3.3.1.1 Small Test PCB   3.3.1.1.1 Basic Types of Test PCB    3.3.1.1.2 RF Grounding with a Rectngular Metallic Frame   3.3.1.1.3 An Example    3.3.1.2 Large Test PCB   3.3.1.2.1 RF Grounding by “Zero” Chip Capacitors    3.3.1.2.2 RF Grounding by a Runner or a Cable with Half or Quarter Wavelength  3.3.2 Isolation between Input and Output in a Mixer or an Up-converter  3.3.3 Calibration for Network Analyzer 3.4 RF Grounding for Reduction of Return Current Coupling  3.4.1 A Circuit Built by Discrete Parts on a PCB   3.4.2 RFICs ReferencesChapter 4 Equivalent Circuits of Passive Chip Parts 4.1 Modeling of Passive Chip Parts 4.2 Characterizing of Passive Chip Parts by Network Analyzer 4.3 Extraction from the Measurement by Network Analyzer  4.3.1 Chip Capacitor  4.3.2 Chip Inductor  4.3.3 Chip Resistor 4.4 Summary ReferencesChapter 5 Single-ended Stage and Differential PairChapter 6 Balun217Chapter 7 Tolerance Analysis239Chapter 8 Prospect of RFIC Design269Chapter 9 Noise, Gain, and Sensitivity of a Receiver317Chapter 10 Non-linearity and Spurious Products339Chapter 11 Cascaded Equations and System Analysis 358Chapter 12 From Analog to Digital Communication System376

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  •   E文中的才好用下。希望后版內(nèi)容豐富一些,有實(shí)例具體才好
  •   內(nèi)容可以說是可以的,其實(shí)就是經(jīng)驗(yàn)之談,可以作為知識(shí)的補(bǔ)缺。英語水平嘛馬馬虎虎,中國式英語,唯一缺點(diǎn)是比較貴,可能是“英文版”吧,哈哈。
 

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