現(xiàn)代應(yīng)用集成電路設(shè)計

出版時間:2011-7  出版社:科學(xué)出版社  作者:周電  頁數(shù):394  

內(nèi)容概要

本書基于作者周電在美國大學(xué)十幾年教授“現(xiàn)代應(yīng)用集成電路設(shè)計”課程的手稿整理而成,主要內(nèi)容包括應(yīng)用集成電路設(shè)計流程、設(shè)計指標(biāo)定義和規(guī)范、邏輯電路設(shè)計、物理設(shè)計、時間功耗性能分析及驗證測試。讀者需要有數(shù)字集成電路和硬件描述語言(VHDL)的基礎(chǔ)知識。按照具體課程設(shè)置的要求,本書可用于一個學(xué)期的教學(xué)內(nèi)容,包括應(yīng)用集成電路設(shè)計流程、設(shè)計指標(biāo)定義和規(guī)范、邏輯電路設(shè)計及物理設(shè)計。關(guān)于集成電路發(fā)展的前沿問題,本書在第7章和第8章中以研究課題為背影介紹了基礎(chǔ)知識。
本書可作為電子和計算機工作專業(yè)的大學(xué)四年級或碩士研究生教材,也適于集成電路設(shè)計的專業(yè)人員參考閱讀。

書籍目錄

Preface
Chapter 1 Introduction
1.1 History of Integrated Circuits
1.2 Roadmap of IC Technology
1.3 ASIC
1.4 Design Flow
1.5 CAD Tools
1.6 AnASIC Design Project MSDAP
1.7 How to Use This Book
1.8 Summery
1.9 Problems
References
Chapter 2 VLSI Design Perspective and Flow
2.1 Introduction
2.2 VLSI Technology Trend
2.3 SoC
2.4 Methodology for Custom and Semi-custom IC Design
2.4.1 Gate array
2.4.2 Standard cell
2.4.3 FPGA
2.5 Design Domain and Perspective
2.6 Design Flow
2.7 Design Task
2.8 Summary
2.9 Problems
References
Chapter 3 Specification Development
3.1 Introduction
3.2 AnASIC Project MSDAP
3.3 An Overall View of the Specific Requirement
3.3.1 The required computation method by the MSDAP
3.3.2 Additional information for the specification
3.4 The System Setting
3.5 I/O Interface and Pins
3.5.1 Pins and their assignments
3.5.2 Signal format and waveform
3.6 Other Issues of the Specification
3.7 Summary
3.8 Problems
References
Chapter 4 Architecture Design
4.1 Introduction
4.2 Datapath Structure
4.2.1 Single processor sequential structure
4.2.2 Multi-processor parallel structure
4.3 Functional Blocks and IPs
4.3.1 IP core
4.3.2 Functional blocks in the MSDAP architecture
4.4 Time Budget and Scheduling
4.5 A Sample Architecture of the MSDAP Project
4.5.1 An architecture sample
4.5.2 Time budget justification of the proposed architecture
4.6 Summary
4.7 Problems
References
Chapter 5 Logic and Circuit Design
5.1 Introduction
5.2 Combinational Logics
5.2.1 Decoder
5.2.2 Encoder
5.2.3 Multiplexer
5.2.4 Arithmetic logic blocks
5.3 Sequential Logics
5.3.1 Latch and flip-flop
5.3.2 Shift register
5.3.3 Counter
5.3.4 FSM
5.4 Datapath
5.5 Asynchronous Circuit
5.6 Summery
5.7 Problems
References
Chapter 6 Physical Design
6.1 Introduction
6.2 Design Rules
6.3 Floorplan
6.4 Routing
6.4.1 Global routing
6.4.2 Local routing
6.5 Physical Layout Verification
6.5.1 DRC
6.5.2 XOR check
6.5.3 Antenna check
6.5.4 ERC
6.5.5 LVS check
6.6 Clock Network
6.7 Power Network
6.8 Engineering Change Order
6.9 Package
6.10 Summary
6.11 Problems
References
Chapter 7 Timing, Power, and Performance Analysis
7.1 Introduction
7.2 Buffer Insertion Mechanism
7.3 Transistor and Gate Sizing
7.3.1 Transistor sizing
7.3.2 Buffer sizing
7.3.3 Gate sizing
7.4 Timing Analysis
7.4.1 Static timing analysis
7.4.2 DTA vs. STA
7.4.3 Circuit simulation in STA
7.5 Interconnect Model and Circuit Order Reduction
7.5.1 Lumped RC vs. distributed RLC model
7.5.2 Circuit order reduction
7.6 Low Power Design
7.7 Design for Manufacture
7.8 High-level Synthesis
7.9 Performance Bound Evaluation
7.10 Summary
7.11 Problems
References
Chapter 8 Verification and Testing
8.1 Introduction
8.2 Digital Circuits Test
8.2.1 Fault modeling
8.2.2 Fault simulation
8.2.3 Test generation for combinational logic
8.2.4 Test generation for sequential logic
8.2.5 ATPG using TetraMAX
8.3 BIST
8.3.1 The concept of BIST
8.3.2 TPG
8.3.3 ORA
8.3.4 BIST architectures
8.4 Scan and Boundary Scan
8.4.1 Digital DFT for scan
8.4.2 Scan chains
8.4.3 Digital boundary scan standard- IEEE 1149.1
8.5 Summary
8.6 Problems
References
Appendix A A MSDAP
A.1 Introduction
A.2 A MSDAP
Appendix B A C-Program Implementing the Algorithm of the MSDAP
B.1 Introduction
B.2 The MSDAP Computation Method in C-Code
Appendix C An FSM for the MSDAP Operation Mode
C.1 Introduction
C.2 An FSM for the Operation Mode and System Setting
Appendix D A Sample Project MSDAP Report
D.1 Introduction
D.2 A Sample Project MSDAP Report

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